promation

2022 INTERNATIONAL SALES TRAINING CONFERENCE

2022 INTERNATIONAL SALES TRAINING CONFERENCE

PROMATION USA’s 2022 International Sales Invitational was an event held at the PROMATION USA North American Headquarters whose primary goal was to educate PROMATION Sales Force on the latest technology trends and new emerging technologies for the electronics manufacturing industry.

INNOVATION | WINTER 2022

INNOVATION   |   WINTER 2022

Hello from PROMATION USA,

As a New Year is upon us, we wanted to not only thank you for your continued support and trust in PROMATION USA; but also invite you to continue your pursuit of perfection with us. We are delighted to introduce several new key products this year to continue adding value into our product line. It is in our continued pursuit of excellence that we continually strive to introduce valuable, cost effective, products and expand upon our existing line of premium automated solutions.

PANDA Soldering System Wins 2020 New Product Introduction Award

PANDA Soldering System Wins 2020 New Product Introduction Award

“We are delighted to accept this award on behalf of all of our team members at PROMATION who have continually dedicated their time and effort into the R&D behind our line of premium automated solutions” states Mike Goldberg. “We believe this strongly compliments our efforts and time towards continued improvement and dedication to industry innovation. We look forward to achieving this type of recognition with us in the year 2020 and beyond.”

This marks PROMATION’s 3rd Technology Award relating to Robotic Soldering in the past 3 years; and overall 5th technology award within the past 4 years.

PROMATION Introduces QUICK 9394F Soldering Robot

PROMATION Introduces QUICK 9394F Soldering Robot

The QUICK 9394F Soldering System features a 4-Axis Robotic Gantry and generous 300mm x 300mm Working Area. With an upgraded 180-Watt Power Supply and 180-Watt Nitrogen Ready Soldering Iron, the unit allows for deeper temperature penetration; while maintianing industry leading temperature stabilty through-out the soldering process.